Combining properties to improve composite fabrication
with functionality such as EMI shielding and conductivity, TFP's
nonwovens provide multi-functional solutions for electronic
Our Optiveil™ &
Optimat® materials are
available in areal weights from as low as 2 g/m² and can provide lightweight
solutions for a variety of challenges faced by electronics
engineers. These include shielding of enclosures from EMI
radiation, delivering the electrical conductivity necessary for
connectors or, in case of our dielectric veils, providing a support
for thin, flexible printed circuit boards (PCB's).
also an ideal candidate for use in the manufacture of composite
housing for electronics. Where, due to the exceptionally even fibre
distribution and excellent resin uptake of the veils, they can
provide a high quality, resin rich surface finish. This also
delivers a cost saving by reducing both the resin content and the
need to grind or polish.
- EMI / RFI shielding of
electronic enclosures - The Optiveil™ & Optimat ® metal coated carbon
materials provide high levels of EMI shielding, these mats and
veils can be tailored to meet the required attenuation values
at certain specified frequencies. This technology can be used as it
comes or incorporated into a composite and offers a competitive
light-weight & thermally stable alternative to traditional
- Printed circuit boards
(PCB's) - Our dielectric Optiveil™ & Optimat® glass veils and mats have
a high thermal stability and low coefficient of thermal expansion,
making them suitable for use as a support for thin, flexible
- High quality surface finish for
electronics housing - Optiveil™ can provide a high
quality, resin rich surface finish without the use of a gel coat.
The materials can deliver a weight & cost saving by reducing
both the amount of paint or resin content required and the need to
grind or polish.
- Heat sink and
thermal management applications - The thermal conductivity of
our metal coated veils and mats makes them suitable for use in heat
sink and thermal management applications.
Please contact us with
your requirements, we would welcome the oppotunity to discuss
further our materials and their applications.